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VPR
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Vicor V•I Chip Components Reduce Energy Costs Increase Efficiency and Power Density
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| Publication
date on this website:
19/12/2006 |
| Category:
Input - Output devices |
| Company:
Vicor UK |
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| Summary: |
Key Points:
Enabling complete systems to use Factorized Power Architecture
Power density up to 1.2kW/in3 or 91A/in2
Up to 97% efficiency
Potential energy savings 24 euros / $30 per processor, per year in energy costs
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| Full
Text: |
Vicor announces the availability of a full family of V•I ChipTM components, enabling complete power systems using Factorized Power Architecture (FPA). FPA separates or `factorizes´ regulation and voltage transformation functions into flexible, high-performance building blocks. V•I Chip components are high-density (up to 1.2kW/in3), high-efficiency (up to 97%), high-speed power conversion modules, and are all released for mass production.
The PRMTM (non-isolated regulator) and VTMTM (current multiplier) components deliver the most efficient 48V direct-to-load power conversion system in mass production today. For low voltage/high current requirements (e.g. microprocessors), the VTM module enables 91A/in2 point of load (POL) density. FPA allows the PRM module to be deployed remotely, providing greater design flexibility and a 95% reduction in distribution loss.
As energy prices increase, the electricity bill for a data center is now 50% of the annual operating cost—growing to more than the initial hardware investment—and it takes 2.6W to drive 1W of computing power in a typical system. A data centre using an FPA solution could save 24 euros or $30 per processor, per year in energy costs. At the same time, the power solution with V•I Chip modules is 45% smaller, enabling further increases in computing rack density.
Vicor´s PRM and VTM modules cover a wide range of input and output voltages at power densities up to 1.2kW/in3 or 100 A per module. FPA solutions are available to meet the advanced requirements of telecom/server (processor and memory power supply), test equipment, RF amplifiers, power supplies, and many other applications.
In traditional 48V architectures, Vicor´s intermediate bus converters, the BCMTM modules, offer four times more power density than any other converter. The 48V BCM modules are available with output voltages of 1.5Vout to 48Vout and up to 300 W and are suitable for telecom/server, base stations, WiFi, data/voice, VoIP (Voice over Internet Protocol), and PoE (Power over Ethernet), as well as solid-state LED lighting, lasers, and broadcast equipment.
In addition, Vicor´s high-voltage (350-380Vin) BCM converters provide efficient high-voltage distribution and post-PFC high voltage DC-DC conversion to non-isolated POL converters in telecom and high-end server systems.
The V•I Chip family is in mass production now with immediate sample availability and four-week production leadtimes. A V•I Chip PRM + VTM chipset to convert from 48V direct to 1V, 100A is available for $49 in OEM quantities (FOB Andover, USA). BCM converters are available from $32.50 each in OEM quantities (FOB Andover, USA).
For more information on the V•I Chip family and FPA, including data sheets, application notes, and customer evaluation boards, please visit www.vicorpower.com/vichip .
Vicor´s comprehensive line of power solutions includes modular, high-density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems.
Note to editors:
A datasheet is available on: http://www.vicorpower.com/documents/datasheets/PRMVTM_Family_ds.pdf
http://www.vicorpower.com/documents/datasheets/BCM_48VFamily_DS.pdf
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| Contact: |
Michelle Norris, VICOR UK
Tel: 01276 678222 (mnorris@vicorpower.com)
Web Site: www.vicoreurope.com
E.mail for publication: vicoruk@vicorpower.com
Laura West, Napier Partnership Limited
Tel: 01243 531123
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